Comprehensive Multi-Die System Design Solution Supports 3Dblox 2.0 Standard and TSMC 3DFabric TM Technologies to Boost Productivity for Fast Heterogeneous Integration Highlights: Synopsys 3DIC ...

Synopsys revealed it is closely aligning its AI-powered EDA suite and multi-die solutions with TSMC's latest process nodes and 3D packaging tech. The goal is to pave the way for designs packing ...

Taiwan computer chip maker TSMC has reported its profit in the last quarter rose 57%, ... (TSMC) logo brands the headquarters in Hsinchu, Taiwan, Wednesday, Oct. 20, 2021. Credit: AP/Chiang Ying-ying.

FILE PHOTO: A logo of chip giant TSMC can be seen in Tainan, Taiwan December 29, ... a Canadian tech research firm, took apart a Huawei 910B AI accelerator and found a TSMC die, ...

--Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3 Dblox 2.0 standard and TSMC's ...