News
TSMC's robust ... clear processors road map (A14 node) extended to 2028, resilient downstream demand from AI customers, potential greenshots from non-AI applications and CoWoS capacity balance ...
TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit. According to Tom’s Hardware, the outfit is working on a 9.5 ...
Large-size CoWoS, SOW-X, and more Meanwhile, TSMC is also advancing its Chip on Wafer on Substrate (CoWoS) technology to meet AI’s growing demand for logic and HBM. The foundry giant announced that by ...
What Happened: Market chatter suggested that Nvidia's CoWoS wafer orders at TSMC had been cut from over 400,000 wafers to 380,000 wafers, fueling concerns about AI demand fluctuations. However ...
will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...
TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...
Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an event hosted by ...
As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. TL;DR: NVIDIA is shifting from CoWoS-S to ...
TSMC raises CoWoS output goal again, say sources TSMC's backend equipment suppliers benefit from AI chip demand TSMC to see CoWoS production capacity reach 60,000 wafers in 2025 ...
TL;DR: TSMC is considering building new CoWoS advanced packaging plants in the US and Japan due to strong demand, particularly for AI chips from NVIDIA. The company plans to double its production ...
Blackwell with CoWoS-L packaging seeks to increase yields ... Nvidia is delivering the history’s most aggressive product road map on new fab processes. This is a “move fast, break things ...
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