Targeted design for test, better fault models, and in-system testing must keep pace with advanced-node components.

The results show that the effective density of bulk and interface trap states is almost ... ranging from 100 to 0.5 mtorr were evaluated from measurements on thin-film transistors (TFTs). The results ...

The Research and Development for 3nm chips are following two approaches: One is the GAA architecture (the standard one, used by TSMC and Samsung ... Delivers its 7nm/5nm Solution in the Kirin ...

Beijing National Laboratory for Molecular Sciences, Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China ...

High-density interconnection is a key enabler of chiplet integration. AI and HPC power delivery requirements are becoming more complex and now necessitate advanced bridge chips with TSV features.

The world's largest semiconductor manufacturer ' TSMC ' and California-based optical interconnect technology developer ' Avicena ' have announced a partnership to develop a photodetector optimized ...

President of TSMC Europe, Paul de Bot ... "It's intended to support European customers in designing high-density, high-performance, and energy-efficient chips with a focus on applications again ...

TSMC announced today it will open a new chip design center in Munich by the third quarter of this year, something viewed as European Union victory as it pursues self-reliance in chip production.

Huawei recently unveiled its first HarmonyOS-powered computer, a significant milestone in the company's technological evolution. According to a report by China's state-run CCTV, the new PC is ...

China's Dawning Information Industry Company (Sugon) and Hygon Information Technology announced plans for a strategic merger on May 25 to consolidate the country's computing power ecosystem.