Astrobotic has been awarded a contract by NASA to develop a supersized version of its solar arrays for building a power grid ...

This study investigates the reliability of solder joints in Ball Grid Array (BGA) packages by examining their dynamic response under board-level drop impacts using Finite Element methods. Explicit ...

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In production processes that use surface-mount technology (SMT) for the assembly of printed circuit boards, automated optical inspection is widely employed to diagnose component defects. However, ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – sol… ...

Ball Grid Array (BGA) Packaging Market Latest Advancements and Business Opportunities 2026 Surface mount technology also called as SMT is a technique of mounting electronic components on the surface ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder b… ...