New fluxless hermetic sealing technique is reported using electroplated Sn-rich soft solder. Specific type of glass (SCG72) is chosen as a lid material to be sealed onto the alumina ceramic package to ...

We have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to ...

Compulab MCM-iMX95 is yet another NXP i.MX 95 system-on-module (SoM), whose main selling point is being offered as a solder-down QFN package with SMD pads. The hexa-core Cortex-A55 Edge AI module ...