Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication ...

Applied Materials, Inc. and CEA-Leti have announced the next phase of their longstanding collaboration to accelerate ...

Discover how Penn State’s 2D CMOS computer breakthrough paves the way for ultra-efficient, atomic-scale electronics beyond silicon.

A research team from the Institute of Biological Information Processing (IBI-3) at Forschungszentrum Jülich, working with ...

Swansea University and Space Forge, pioneer in space-based materials manufacturing, have signed a major deal, making the ...

Axcelis leverages ion implantation expertise to thrive in the semiconductor sector. Read more about ACLS stock's 65% upside ...

TFLN wafer line is well-positioned for aggressive push into cloud and supercomputing, AI model training and inference, expert ...