Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication ...