A 3D-IC with silicon interposer has the advantages of high performance ... Cadence’s Clarity 3D Solver is designed to tackle EM challenges when designing complex 3D structures on chips, interposers, ...

At the IEEE ECTC 2025 conference, imec highlights the exceptional performance and flexibility of its 300mm RF silicon ...

This is where chiplet-based heterogeneous systems, built on RF silicon interposer technology, can make the difference, enabling the seamless integration of digital and RF components. At last year’s ...

Imec has demonstrated the exceptional performance and flexibility of its 300mm RF silicon interposer platform. The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a ...

Until now, GPUs such as those from AMD and Nvidia have consisted of several chiplets located next to each other on a silicon interposer. Fast memory modules of the high-bandwidth memory (HBM ...

NVIDIA's vision of the future of AI compute has been teased: the AI GPU leader sees the use of a silicon photonics interposer, 3D stacked DRAM, and GPU 'tiers' that tease GPU on GPU tech in the ...