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Just because the various components in an advanced package work individually and separately doesn't mean they will work ...
HBM compatibility vs. customizability; 3D-IC marks shift for EDA; AI ToF decoding; AI-defined vehicles; genAI in EDA.
Integrated circuits have evolved from simple microchips to complex, nanoscale marvels, driving advances in computing, ...
1d
Tech Xplore on MSNSuperconducting circuit could one day replace semiconductor components in quantum computing systemsIn 2023, about 4.4% (176 terawatt-hours) of total energy consumption in the United States was by data centers that are ...
Once considered merely insulating, a change in the angle between silicon and oxygen atoms opens a pathway for electrical ...
2d
Interesting Engineering on MSNChina’s new hypersonic heat shield beats thermal limits, withstands 6,512°F tempChinese scientists have created a new material capable of withstanding temperatures of up to 3,600 degrees Celsius (6,512 ...
The result is the development of the UltraCMOS+ RF SOI platform, which includes proprietary semiconductor processes, product ...
Advanced Energy Industries, Inc. announced a new silicon-controlled rectifier (SCR) power controller for precision control of ...
The Price to Earnings (P/E) ratio, a key valuation measure, is calculated by dividing the stock's most recent closing price by the sum of the diluted earnings per share from continuing operations ...
6d
Tech Xplore on MSNImec achieves record-breaking RF GaN-on-Si transistor performanceImproved contact resistance and RF output key toward mobile-compatible E-mode GaN-on-Si transistors. Imec has set a new ...
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