Micromachining silicon with lasers (but no sharks)! Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser ...

Synova's Laser MicroJetÒ(LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry.

Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts processing ...

Wafer scrap rates have reached up to 5 to 10 percent, a rate that is hard to bear for manufacturers when the price for a wafer is NT$300,000, he said. The institute uses a nanosecond pulsed laser ...

A laser used in cosmetic dermatology for nearly 40 years showed properties similar to those seen with other types of lasers.

Wafer Stealth Dicing / Motion Control for Laser Based Semiconductor Wafer Dicing. 5-DOF Stage for Wafer Stealth Dicing / Semiconductor Wafer Dicing. Video Credit: PI (Physik Instrumente) LP ...

The rapid growth in applications such as wafer grooving and precision cutting of display stacks for mobile and next-generation IT devices is accelerating the need for laser tools with higher ...