Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser Breaking Taps Posted: March 20, 2025 | Last updated: March 20, 2025 ...

Synova's Laser MicroJet Ò (LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry. DUILLIER, Switzerland ...

Wafer scrap rates have reached up to 5 to 10 percent, a rate that is hard to bear for manufacturers when the price for a wafer is NT$300,000, he said. The institute uses a nanosecond pulsed laser ...

Synova says that one of the most significant issues with dicing SiC wafers is blade wear – LaserMicroJet technology removes this worry and lowers the downtime and corresponding cost of ownership.

Pulsed hybrid laser looks good for fiber-optics. 29 Aug 2007. A mode-locked silicon evanescent laser could lead to high-speed data transmission. Building on their previous development of a hybrid ...

Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts processing ...