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Taiwan Semiconductor Manufacturing Co (2330.TW), the world's largest contract chipmaker, is still assessing when it will use ...
and Microsoft to use its Intel 18A process node (classified as 2nm) for their upcoming chips, which would move some large orders away from TSMC. In a post shared on X by insider @Jukanlosreve and ...
Intel also stated that 'Intel 18A-P,' a derived node with enhanced ... chain compared to TSMC and Samsung Electronics, and if it succeeds in stabilizing its 18A process, it is expected to reap ...
Rival Intel (NASDAQ:INTC) has planned to use the High-NA EUV machine in its future manufacturing process ... advanced nodes in a latter phase. Last year, Zhang had told reporters TSMC will ...
At least on the 18A process node ... recent report on Intel Foundry. This new report, published on Monday, implies that Apple might be the newest Foundry customer as TSMC, Apple's current ...
Intel is also reportedly using TSMC's new 2nm process node for the compute tiles on its next-gen Nova Lake CPUs. TSMC's list of 2nm clients includes Apple, NVIDIA, AMD, Qualcomm, Intel ...
3d
Tom's Hardware on MSNTSMC reiterates it doesn't need High-NA EUV for 1.4nm-class process technologyTSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV ...
9d
YouTube on MSNLeo Says EP.67 - Will Intel use TSMC N3 for Arrow Lake?In the last Leo Says, Leo discussed Intel's statement that it would deliver five fabrication nodes in four years. These are bold claims that were immediately challenged by news that Intel would ditch ...
According to Korea’s ChosunBiz, Intel is now in talks with Microsoft, Google, and Nvidia to fab chips on the upcoming 18A node, a potential rival to TSMC’s 2nm N2 process. The news comes as ...
it seems like it could set TSMC up well for more intense competition against Intel even if the American chipmaker could achieve process node parity, as it doesn’t necessarily indicate that they ...
Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all ... Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and ...
This shift in manufacturing allows Intel to leverage the advanced capabilities of TSMC’s process nodes while still maintaining control over the base tile’s design. One of the unique aspects of ...
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