The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic ...

Different from Chip on Wafer stacking technology, Wafer on Wafer (WoW) stacking can provide a tighter pitch and higher interconnect density with higher through-put. The difficulty for WoW stacking is ...