An overview of the MRDIMM technology as a solution to memory bandwidth and capacity challenges.

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

New chip merges quantum light factories with on-chip control, enabling real-time stabilization of photon generation across 12 sources.

Professor Prem Kumar and a multi-institution research team built a first-of-its-kind silicon chip combining a photonic ...

When Kaynes Semicon got greenlit by the India Semiconductor Mission in April 2024, most assumed the usual two-year delay ...

Advances in MMIC and RFIC technologies are driving 5G/6G and satellite communications with multi-band support, digital beamforming, and emerging sub-THz frequencies, while addressing key challenges in ...

Automated test equipment market is pivoting from speed-centric instruments toward cloud-anchored, AI-driven, mixed-signal platforms that handle 6G, E ...

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Sercomm's TPM530M integrates Nordic’s cellular nRF9120 SoC and PMIC in a compact package, ensuring robust cellular IoT wireless connectivity for space-constrained applications Sercomm Corporation, a ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million gates needs a way to get all that data in and out! Early on, packages just ...

Specialized external testers and custom load-boards cannot be used for testing die-to-die interfaces in a multi-chip in a package product as there is no access to the TX/RX buffers. On the other hand, ...

Abstract: Die-to-die (D2D) interconnects facilitating inter-chiplet communication are expected to grow exponentially over the coming years as more functionality is packed into multi-die packages.