MIV (Monolithic Inter-Tier Via): A nanoscale vertical connection that links different layers in a 3D integrated circuit, allowing for efficient inter-layer communication.

Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and miniaturization needs ...

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry Business Wire Jun 16, 2025 ...

Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and miniaturization needs.

System-in-Package (SiP) integration approaches Co-Packaged Optics (CPO) implementations Monolithic 3D integration pathways Advanced IC substrate technologies ...

Large language models (LLMs) like ChatGPT are just the starting point for generating content with AI. The next phase will be about harnessing LLMs with agents, providing automated feedback and ...

Monolithic 3D integration technology has emerged as an alternative candidate to conventional transistor scaling. Unlike conventional processes where multiple metal layers are fabricated above a single ...

InGaOx GAA transistor Researchers from the University of Tokyo created a gate-all-around transistor made from gallium-doped indium oxide (InGaOx). Doping indium oxide with gallium suppressed oxygen ...

Monolithic 3-D (M3D) integrated circuits (ICs) introduce a new aspect to the physical design problem by stacking dies vertically. We introduce a novel heterogeneous design for M3D ICs, which utilizes ...

Electronic devices are components for controlling the flow of electrical currents for the purpose of information processing and system control. Prominent examples include transistors and diodes ...