Arkema (Paris:AKE) successfully completed today a €400 million undated hybrid bond issue with an annual coupon of 4.25% and a first call date after 5 years.

Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a ...

Veolia raises €500 M for its first ever hybrid Green Bond issuance with an outstanding level of oversubscription ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory ...

Veolia (Paris:VIE) has successfully completed its first ever green bond issuance, for 500 million euros. It takes the form of deeply subordinated perpetual hybrid notes, bearing a coupon of 4.371% ...

Hybrid bonding offers advantages over ‘bump-based’ interconnects, but high yield production relies on inspection. By Hari Polu. Hybrid bonding is quickly gaining recognition due to the enhanced ...

Samsung Electronics and SK hynix are considering the introduction of hybrid bonding technology to the next-generation high bandwidth memory (HBM) stacking method, leading to anticipated shifts in ...

A man suspected of attempting to smuggle SK hynix tech secrets to China was apprehended at South Korea’s Incheon ...

Revenue came in below FactSet consensus of EUR 160 million, but investors liked the results due to progress in hybrid bonding adoption. Shares are up 10%. Why it matters: BE Semiconductor reported ...