Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth ...

Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive ...

Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

HONG KONG] LG Electronics shares advanced in Seoul after a local media report that the company is developing cutting-edge ...

Samsung is switching from thermal conductive bonding (called TCB) to hybrid bonding for its 16-layer HBM systems for mass production, which is expected in 2026.

TAIPEI, Taiwan, October 30, 2024--TrendForce reveals that HBM5 20hi stack products will adopt hybrid bonding technology by 2025, which could transform DRAM industry's business models ...

In R&D, the industry is working on hybrid bonding to enable new 3D DRAM types, namely 3DS (three die stacked) DRAMs. Some are developing new high-bandwidth memory (HBM) cubes. Also in R&D, many are ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...

Hybrid bonding overcomes these bottlenecks by providing direct copper-to-copper interconnects at pitches below ten microns, allowing logic and HBM stacks to exchange terabytes per second while ...