Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

LG shares experienced gains in Seoul following reports that the company is developing advanced tools for manufacturing memory chips used with AI processors from Nvidia and other firms. According to ...

Shares flat; gold miners rise on fresh tariff threats; Hansen Technologies rockets; CityChic misses earnings guidance. Follow ...

HONG KONG] LG Electronics shares advanced in Seoul after a local media report that the company is developing cutting-edge ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

This hybrid bonding changes the material's structure and behavior, turning a metal and an insulator into a new type of semiconductor.

This hybrid bonding changes the material's structure and behavior, turning a metal and an insulator into a new type of semiconductor.

An international team of researchers led by Rice materials scientists has succeeded in creating a genuine 2D hybrid material called glaphene.