Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

HONG KONG] LG Electronics shares advanced in Seoul after a local media report that the company is developing cutting-edge ...

Shares flat; gold miners rise on fresh tariff threats; Hansen Technologies rockets; CityChic misses earnings guidance. Follow ...

After a decade overseeing DRAM processes at Samsung Electronics, a 43-year-old engineer known as A accepted a job at SK hynix ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

LG shares experienced gains in Seoul following reports that the company is developing advanced tools for manufacturing memory chips used with AI processors from Nvidia and other firms. According to ...

BlueNord has successfully placed a new USD 300 million subordinated callable hybrid bond issue with maturity in 2085. The hybrid bond will have the first call at 100% of nominal value and coupon ...

Hybrid cars are capable of traveling for amazing distances on a single tank of gas. This hybrid car gets the most driving range on a full tank.

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

Keyera's acquisition from Plains All American is a gamechanger, with insights on valuation metrics and the logic behind hybrid bonds. Find out more on KEY:CA.