Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new ...

In this study, the recent advances and trends of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges ...

Fine-pitch wafer-to-wafer hybrid bonding is pivotal for advancing semiconductor integration and requires high overlay accuracy to ensure device performance and ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive ...