NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Taiwan Semiconductor Manufacturing has outperformed 2024 expectations by wide margins. Check out 3 reasons to buy TSM stock.

These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...