CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. “You could call it the Nvidia packaging process if you ...

Almost anyone making AI chips is using the CoWoS process,” said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity.

Nvidia's demand for the CoWoS-L process will likely increase substantially to 380,000 wafers in 2025 from 32,000 in 2024, a year-on-year increase of 1,018%. Therefore, ...

TSMC is expected to raise prices by 5-10% for its advanced 5nm and 3nm process nodes, and 15-20% for CoWoS advanced packaging due to AI demand.

Almost anyone making AI chips is using the CoWoS process,” said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity.

Almost anyone making AI chips is using the CoWoS process,” said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity.