TSMC’s advanced CoWoS and SoIC lines have become the key bottleneck for AI memory bandwidth, giving the company commanding pricing power. The foundry is replicating this 3D packaging and wafer ...

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Contrary to market rumors suggesting a reduction in Nvidia’s 2025 CoWoS wafer production plan at TSMC from more than 400,000 wafers to 380,000, Kuo’s findings indicate no such decrease.

Figure 1 CoWoS-L marks a significant advancement over CoWoS-S in terms of performance and efficiency for AI and HPC applications. Source: TSMC Huang also told Taiwanese reporters that Nvidia is still ...

TSMC plans to expand eight CoWoS facilities in the short term, including two at ChiaYi Science Park Phase 1 and two facilities acquired from Innolux (AP8). Notably, although ChiaYi Science Park Phase ...

Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC.

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia 's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology.

For context, Nvidia has relied mainly on CoWoS-S to combine its AI chips. Nvidia’s Blackwell AI chip leverages Taiwan Semiconductor’s CoWoS advanced packaging technology.

The 200 series, which includes the GB200 NVL72 and HGX B200, features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX B300 NVL16, use ...

According to Ming-Chi Kuo, Nvidia's declining CoWoS-S capacity is part of their plan to match the 200 Series roadmap, which excludes single-die devices. Nvidia intends to provide GB300 NVL72 ...