Even if you manage to get the right parts, the process of upgrading involves soldering BGA (Ball Grid Array) parts, which requires specialized tools and skills.

This study investigates the reliability of solder joints in Ball Grid Array (BGA) packages by examining their dynamic response under board-level drop impacts using Finite Element methods. Explicit ...

You can see different kinds of soldering in greater detail than ever before, including Ball Grid Arrays on circuit boards, chips, and even leaded soldering. It's a fun watch, even if you've never ...

Ball Grid Array (BGA) packaging is a game-changer in electronics. Unlike traditional packaging methods, BGA replaces pins with solder balls, significantly improving the connection between the ...

Test points have been around for a while, but their modest role continues to expand in today’s crowded boards dominated by surface-mount (SMT), ball-grid-array (BGA), and land-grid-array (LGA ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – sol… ...

When solder is strained, the bonds between your components and the circuit board can deform, crack, or break, leading to failure risk. Read our Top 5 Reasons for Solder Joint Failure blog to learn ...