With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

Intel is testing a new way to tackle the growing heat output of its power hungry chips. At its recent Foundry Direct Connect ...

An electronics upgrade and repair wizard has demonstrated how to boost the Raspberry Pi 5’s RAM quota. MadEDoctor shared a brief video on YouTube where they removed the 4GB RAM chip from a ...

BGA Flux Pastes: are usually designed based on the requirement for lead-free soldering, so they do not contain lead in their composition and usually have a higher melting point and a longer melting ...

Plastic Ball Grid Array,Solder Joints,Specific Phenomenon,Thermal Fatigue,Thermal Load, Zhen-jun Zhu, male, a master The State Key Lab.

LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...