He characterized Apple as, “thrilled that Apple Silicon will soon be produced ... some packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS).

In contrast, InFO is used by Apple for its A-series application ... “Amkor is proud to collaborate with TSMC to provide seamless integration of silicon manufacturing and packaging processes ...

Sources familiar with the matter tell the Commercial Times that production of the A20 SoC will begin at the Chiayi AP7 plant in Taiwan. The current ...

The 1nm smaller chipset from TSMC will upgrade the existing architecture found on current Apple silicon processors which ... including its switch from InFo (Integrated Fan-Out) packaging to ...

The publication attributed the information to Apple analyst ... some of the upcoming M5 chips will also use TSMC’s 2.5D packaging technology. Apple’s M-series Mac chips each include a ...

Over the last four years, the company has poured more than $90 billion into capital expenditures aimed at expanding its ...

Apple's journey into custom silicon has been driven by a singular ... particularly with TSMC's Integrated Fan-Out (InFO) technology, positions the company to lead in the AI and cloud computing ...

That is despite the fact that the Apple iPhone 15 Pro went on sale in September 2023 with N3 silicon and TSMC has since introduced ... sponsors By submitting your information you agree to the ...

The iPhone manufacturer in particular, whose Apple Silicon SoCs ... manager told The Information. But this is becoming increasingly difficult. There are allegations that TSMC used an intermediary ...