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Tech Xplore2d
3D chip stacking method created to overcome traditional semiconductor limitations
A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
The 2nm Race: Intel’s 18A Faces Uphill Task Against TSMC
Over the last four years, the company has poured more than $90 billion into capital expenditures aimed at expanding its ...
C&EN4d
Construction of Multilayer Films and Superlattice- and Mosaic-like Heterostructures of 2D Metal Oxide Nanosheets via a Facile Spin-Coating Process
Department of Pure and Applied Chemistry, Faculty of Science and Chemistry, Tokyo University of Science, Yamazaki 2641, Noda, Chiba 278-8510, Japan International Center for Materials ...
C&EN6d
A Unique Optical and Electrical Multifunctional Metal−Organic Framework Based on Polynuclear Rod-Shaped Secondary Building Units Constructed from a “Three Birds with One ...
† Department of Chemistry, College of Science, Northeast University, Shenyang, Liaoning, 110004, People’s Republic of China ‡ Key Laboratory of Polyoxometalate Science of Ministry of Education, ...