Challenges include probing fine-pitch micro-bumps and maintaining test access throughout 3D stacks. Solutions include ...

Taken together, the 3D chip integration technologies developed by researchers from Science Tokyo have the potential to transform next-generation computing architectures. Image: BBCube™ — Bumpless ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above ...

Advanced packaging continues to attract a lot of attention as the demands for higher performance, higher bandwidth, and lower power consumption increase. To satisfy aforementioned demands, researchers ...

Fujitsu teases mechanical sample of its new Armv9-based 144-core 'Monaka' processor for data centers, competes against AMD EPYC, Intel Xeon processors.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance ...

The roadmap even forecasts pitches of 400nm and 200nm. Figure 3 – Wafer-to-wafer hybrid bonding is a key technology for integrating 3D-SoC at the µm interconnect density level. Imec’s proprietary ...

The W2W 3D IC project with partner collaboration targets edge AI applications – such as home and industrial IoT, security, and smart infrastructure – requiring mid-to-high range computing ...

Positioned neutrally and strategically, Faraday enhances flexibility and efficiency in advanced package service for multi-source chiplets, packaging, and manufacturing.