Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

Some of the current assembly issues of fine-pitch chip-on-flex (COF) packages for LCD applications are reviewed. Traditional underfill material, anisotropic conductive adhesive (ACA), and ...

Challenges include probing fine-pitch micro-bumps and maintaining test access throughout 3D stacks. Solutions include ...

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

We brought the COG (chip on glass) bonder for LCD application to market in 1988. Since then, we have been successfully developing various types of flip chip bonders to meet a variety of market needs ...

Taken together, the 3D chip integration technologies developed by researchers from Science Tokyo have the potential to transform next-generation computing architectures. Image: BBCube™ — Bumpless ...

A new 3D chip stacking method developed in Japan promises to revolutionize AI and high-performance computing with faster data transfer, reduced power consumption, and compact integration.

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above ...