ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

Taken together, the 3D chip integration technologies developed by researchers from Science Tokyo have the potential to transform next-generation computing architectures. Image: BBCube™ — Bumpless ...

Advancements in semiconductor fabrication technologies and chip packaging processes have been central to the explosive growth of these electronic devices. However, in today's age of artificial ...

Challenges include probing fine-pitch micro-bumps and maintaining test access throughout 3D stacks. Solutions include ...

A new 3D chip stacking method developed in Japan promises to revolutionize AI and high-performance computing with faster data transfer, reduced power consumption, and compact integration.

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

We brought the COG (chip on glass) bonder for LCD application to market in 1988. Since then, we have been successfully developing various types of flip chip bonders to meet a variety of market needs ...

In the post-Moore era, the chiplet technology based on advanced packaging would be a quite promising solution for the high-performance AI chips. The chiplet technology with 2.5D/3D stacking package ...