The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology ...

TSM is the pioneer of an advanced semiconductor chip packaging technique called chip-on-wafer-on-substrate (CoWoS). Put simply, this involves stacking many semiconductor chips together ...

Meanwhile, other players in Nvidia's supply chain may also feel the effects as demand for CoWoS-S packaging decreases. In the broader context, Nvidia's shift to CoWoS-L is likely to accelerate the ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...