This is what 2.5D advanced packaging (CoWoS) looks like, with ASE showing off an incredible model in Taiwan of how the components are bound together.

As electronic devices become faster, smaller, and more powerful, the way chips are packaged is transforming the tech world.

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump, unveiled a $100 ...

CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. “You could call it the Nvidia packaging process if you ...

Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP) ...

Chip packaging just got absurdly massive TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit. According to Tom’s ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.

Goldman Sachs raised its price target for Taiwan Semiconductor Manufacturing Co to NT$1,210 from NT$1,145, saying concerns about large AI-chip order cuts have eased while demand for the company’s ...

The Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly increased its orders for machines needed for Chip on Wafer on Substrate (CoWoS) packaging by 30% to keep up with the rising ...

The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.

Shortages of a key chip packaging technology are constraining the supply of some processors, ... CoWoS technology also underpins Nvidia’s previous flagship graphics card, the A100.

CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. “You could call it the Nvidia packaging process if you ...