When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical ...

The last few years have shown progress in finite-element analysis intended for use by design engineers. Many programs that work with CAD provide several different types of analysis, and the range of ...

Performing modal simulation using a FEM mesh. The design and analysis of an IP67-rated rectangular enclosure. Adding epoxy resin to a vibration sensor enclosure. Mounting techniques for a vibration ...

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...