TL;DR: Apple's M5 series processors, using TSMC's N3P node ... use server-grade SoIC packaging, with the iPhone giant to use 2.5D packaging called SoIC-mH (molding horizontal) to improve ...

TSMC has reportedly secured ... on increasing its next-generation chip packaging (CoWoS) production capacity. Apple will reportedly use SoIC with Hybrid molding (thermoplastic carbon fiber board ...

Apple has reportedly expanded its cooperation with TSMC for the next-generation hybrid SoIC packaging technology, which also combines thermoplastic carbon fiber composite molding technology.

When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that the company planned to serve TSMC’s customers in the state. Apple is ...

TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit. According to Tom’s Hardware, the outfit is working on a 9.5 ...

TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced ...

Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity ... Locascio said the US is talking to TSMC about research and development ...

Aug 1 (Reuters) - Taiwanese chipmaker TSMC (2330.TW), opens new tab has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics (005930 ...

Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its ...