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Computer Simulates Thermal Stress Date: August 13, 2008 Source: Fraunhofer-Gesellschaft Summary: A new simulation method has made it possible to predict in record time when and where heavily ...
Intros designer-focused, CAD-integrated thermal and fluid simulation based on Simcenter technology; extends model-based ...
Testing and Simulation of Thermal Expansion . When temperatures increase, most materials tend to expand, causing a change in material dimensions. When two materials that exhibit different thermal ...
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Managing Thermal Stress: The Importance of Coefficient of Linear Thermal Expansion (CLTE) Testing in Adhesive Bonding - MSNThermal expansion can be determined by applying the ISO 11359-2 test standard. Testing and Simulation of Thermal Expansion When temperatures increase, most materials tend to expand, causing a ...
The Cadence Celsius Thermal Solver integrated within the Cadence IC, package, and PCB implementation platforms provides early-stage system analysis of thermal and stress fields. This paper ...
Combined thermal performance and FEA simulations on the other HRSG modules showed that there were several more high-stress areas caused by temperature differences across the tube rows. 4. Checking ...
(C) Simulation result chart with various underfill thermal conductivities. Case study 2: Large body package The second case study in this presentation is a coupled structural-thermal simulation of a ...
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Thermal Stress Analysis of Aerospace Optical Cables for Rail and Space Applications - MSNThermal stress simulation analysis of aerospace optical fibers and connectors and related extensions to high-speed railway area. High-speed Railway. DOI: 10.1016/j.hspr.2024.04.001, ...
To study the thermal stress distribution of PCM-glazed units, a method combined numerical simulation and experimental analysis was conducted. First, the heat transfer performance and thermal stress ...
Aibuild, a leading innovator in advanced manufacturing software, introduced the BETA release of its new Finite Element ...
--Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3 D-IC systems manufactured with TSMC's 3 DFabric™ advanced packaging ...
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