Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California to outline the company's progress on its foundry initiative.

Earlier this month, Intel Foundry announced it was developing a performance-enhancing variant of its 18 A process that would support its Foveros Direct 3D with hybrid bonding interconnects. This will ...

Trying to copy AMD Chipzilla might have found a way to copy AMD’s X3D cache magic, using its shiny new 18A-PT process and hybrid bonding trickery. Before the gathered throngs at Intel’s Direct Connect ...

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at ...

Intel has reportedly placed orders with TSMC for its bleeding-edge 2nm-class ... and is rumored to feature up to 52 hybrid cores (16P+32E+4LPE) segmented into two blocks of eight Coyote Cove ...

Nvidia’s Rubin GPU, to be introduced in late 2026, will reportedly use TSMC-SoIC 3D packaging technology, which uses hybrid bonding among other technologies. On April 14, wide-moat Applied ...

TL;DR: Intel is outsourcing its upcoming Nova Lake desktop CPUs to TSMC’s advanced 2nm process, marking a major architectural shift with up to 50% performance gains. This move positions Intel ...

Credit: TSMC After AMD, Intel has also placed orders with TSMC for its cutting-edge 2nm process. Intel has long been one of TSMC’s key clients for advanced nodes. Last February, Intel CEO Pat ...

Intel CEO Lip-Bu Tan confirmed a meeting with TSMC CEO C.C. Wei, exploring potential collaboration between the chipmaking giants. While Tan expressed interest in partnership, TSMC previously ...

While Intel is set to debut its own 18A process incorporating GAA later this year, reports suggest that the company's CPUs slated for 2026 will actually be among the first to adopt TSMC's version ...