Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
TL;DR: TSMC will start equipment installation at its largest CoWoS advanced packaging plant, AP8, in Southern Taiwan Science Park in April 2025, with completion by year-end. The plant will house ...
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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacksTSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...
TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...
TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...
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Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUsWhen Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that the company planned to serve TSMC’s customers in the state. Apple is ...
TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...
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