News
Hosted on MSN2mon
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacksTSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...
TSMC's robust ... clear processors road map (A14 node) extended to 2028, resilient downstream demand from AI customers, potential greenshots from non-AI applications and CoWoS capacity balance ...
TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit. According to Tom’s Hardware, the outfit is working on a 9.5 ...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x reticle size.
will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target AI-specific ...
As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. TL;DR: TSMC will start equipment installation ...
TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...
TSMC's Advanced Backend Fab 7 will cost TSMC several billions of dollars and will be equipped to support advanced backend packaging technologies like InFO CoWoS. TSMC's CoWoS-S is used for AMD's ...
As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. The world of AI chips hasn't stopped, and won ...
Taiwanese authorities have let TSMC to proceed with construction of its Advanced Backend Fab 7 phase 1 after an archeological discovery was made earlier this summer, which led to a suspension of ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results