The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface.

The /syscall procfs entry could be abused if attackers launch commands to output 24 bytes in uninitialized stack memory, leading to a bypass of Kernel Address Space Layout Randomization (KASLR).

IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM.