As fast as modern electronics have become, they could be much faster if their operations were based on light, rather than ...

IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron ... vertical conduits that electrically connect a stack of individual chips.

Forward-looking: Major chipmaking companies have been trying to stack different kinds of silicon ... the new tech will debut in fourth-gen high-bandwidth memory due out in 2025.