In a peer-reviewed paper, published in the journal Device, the team investigated the potential of wafer-scale accelerators - ...

The promise of a new type of computer chip that could reshape the future of artificial intelligence and be more ...

TSMC is expected to further solidify its leadership position with the ramp-up of 2nm technology, and its continued ...

The wafer is then etched with hydrofluoric acid to dissolve the silicon dioxide where the photoresist was removed. The remaining photoresist is stripped away, leaving behind just the oxide layer ...

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. Aspencore network. News & Analytics ... enabling a close connection to the AI ...

The silicon wafers are a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometers, Infinion said. The company said the wafters will help increase ...

Infineon has unveiled the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometers, ... here voltages have to be reduced from 230 V to a processor voltage below 1.8 V.

Apple has begun mass production of its next-generation M5 chip, according to South Korean media, with the processor expected to arrive in devices potentially as soon as this year.