Silicon compute and memory dies can be attached to the surface of Passage, while communication between the dies is handled either electrically or optically depending on the distance from each other.

This contains isolated silicon areas that provide numerous ... Intel already used FIVR 11 years ago. Cross-section of how TSMC envisions interposer technology in future AI accelerators.

Interposers with through-silicon ... interposer applications by two different printing methods, that is, inkjet and super inkjet (SIJ), using an inkjettable UV-curable hybrid polymer. We study ...

connected across a 2.5D silicon interposer. Two ARM Cortex-A9 processors built on a GLOBALFOUNDRIES’ 28nm-SLP (Super Low Power) process technology are attached to a silicon interposer, which is built ...

Until now, most of the implementations of 2.5D have been for high-speed networking and server applications because the cost of a silicon interposer is so high. That price tag averages about $30, ...

How to use high-density fan-out (HDFO) technology to replace the TSV-bearing silicon interposer with an organic interposer to enable higher bandwidth die-to-die interconnects for heterogeneous ...

The IP includes a scalable and optimized PHY and die-to-die I/O needed to drive the interface between the logic-die and the memory die-stack on the 2.5D silicon interposer. Open-Silicon's HBM2 IP ...

connected across a 2.5D silicon interposer. The design is a test... Save my User ID and Password Some subscribers prefer to save their log-in information so they do not have to enter their User ID ...

This silicon capacitor developed by Empower can be embedded into an SoC substrate or interposer, replacing MLCCs. The ubiquitous power-rail decoupling capacitor, located as close to its load as ...

Dr. Navid Asadi’s group examines how silicon interposer technology is used with chiplets and chip packaging. This is the third of a mutlipart series on chip packaging technologies. Navid Asadi ...

Sarcina’s interposer packaging technology integrates memory solutions with high-efficiency interconnects. According to Dr. Larry Zu, CEO of Sarcina Technology, "Six years ago, after prototyping a 2.5D ...