Worcester, Mass. — Allegro MicroSystems has announced a new series of RGB multi-chip LED modules that provide a range of high-powered ALGaInP red, and InGaN green and blue LEDs that can be used in ...

Multi-die packages are flavour of the month among the high-power LED manufacturers. Certainly for both manufacturers and designers chasing the title of “highest lumen output” device, this approach ...

Within a footprint of 2.89mm x 2.89mm, the package consists of 36 pixels; each pixel consists of a red, green and blue LED chip. A total of 108 LED chips are interconnected via micron-level ...

Unfortunately multi-chip LEDs are more difficult to use than multiple single die solutions in both of these respects. Firstly taking four or more dies and putting them in to a single package means ...

Chiplet technology, used in multi-chip modules with the ODSA open source switch fabric could lead to new generations of advanced computational storage devices for enterprise, data center and edge ...

New York, May 15, 2023 (GLOBE NEWSWIRE) -- According to PMR, the Global Chip Scale Package (CSP) LED Market is expected to reach a market value of US$ 1 billion in 2023 and is projected to reach ...

Mark Bohr opens up on the company’s push into multi-chip solutions, and upcoming issues at 7nm and 5nm. Mark Bohr, senior fellow and director of process architecture and integration at Intel, sat down ...

San Francisco: As chip packaging gets more advanced, Intel has said it aspires to put a trillion transistors in a package by 2030 with his next-generation chip packaging technology. Intel has led ...

In September, Samsung also pushed into the lead on density of NAND flash, trotting out a 32-Gbit chip made on 40-nanometer. That trumped an earlier release by IM Flash Technologies LLC, a joint ...