Marvell Technology, Inc. (NASDAQ:MRVL) launched the latest addition to its IP portfolio of custom AI compute platforms, a ...

Fig. 1: Steps in the fabrication of package substrates. In this study, a new package structure which is a multi-chip module (MCM) rtMLF was researched. The MCM rtMLF design layout was proposed ...

Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...

SiP has been around since the 1980s in the form of multi-chip modules. Rather than put chips on a printed circuit board, they can be combined into the same package to lower cost ... time-consuming and ...

Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand ...

Taiwan's TSMC has inked a deal with US semiconductor ... packaging and testing – were outsourced to Asia. Advanced packaging, which integrates multiple chips into a single module, is becoming ...

Sustaining Moore’s Law Packaging research is also seen as a way to remain on the cutting edge of semiconductor innovation. Historically, semiconductor research has focused on increasing the number of ...

Advanced semiconductor packaging market is segmented by ... As telcos spread mmWave and sub 6 GHz coverage, orders for multi chip, antenna in package modules scale in lock step with network ...

First 76-81 GHz industry SPEKTRATM Antenna in Package (AiP) Modules ... chips for software-defined radar and communications applications. “We are excited to see Metawave’s modular ...

In semiconductor MEMS multi-chip modules, IC and MEMS chips are positioned side-by-side in a common package and interconnected using wire and/or flip-chip bonding at the package level. Several MEMS ...

From Celestial AI to Taalas, these startups are seeking to challenge Nvidia’s AI computing dominance or find other areas ripe for disruption in the semiconductor industry. Nearly two years ago ...