The electrochemical deposition (ECD) equipment market for IC ... a chip. ECD also provides the copper metallization and other metals in IC packages. Regardless of where it is used, the principles are ...

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

ROHM Semiconductor announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...

Generally, in many IC packages, the devices are situated on top of a substrate ... Ceramic-based packages are used for surface-mount devices, CMOS image sensors and multi-chip modules. These ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

Taiwan's TSMC has inked a deal with US semiconductor ... packaging and testing – were outsourced to Asia. Advanced packaging, which integrates multiple chips into a single module, is becoming ...