A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.

Gorchichko et al., “Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at sub-0.5um Pitch,” 2024 IEEE 74th Electronic ...

Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

It will come down to price, availability, and the CPU-GPU compute ratio that companies need. What we want to know is how MI300A compares in terms of price, price/performance, and thermals with a Grace ...

While working at Huawei, the suspect allegedly took IP related to CMOS image sensors (CIS) and hybrid bonding chip packaging technology that is used for 3D NAND, HBM3/HBM3E/HBM4 memory, as well as ...

SAM—an industry standard for inspection of semiconductor components to identify defects such as voids, cracks, and delamination—has been adapted to facilitate 100% inspection of hybrid bonded packages ...

BE Semiconductor Industries (Besi) expects a rise in demand for its hybrid bonding systems in 2025 following shipment delays in the fourth quarter, the chipmaking parts supplier said on Thursday ...

SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will ...

Degroof Petercam analysts said the upturn, which they expect to materialise in late 2025 or early 2026, should be stronger for Besi given its lead in hybrid bonding technology. ($1 = 0.8787 euros) ...