TSMC is expected to charge $45,000 for 1.4nm silicon wafers in 2028, up 50% from the $30K it charges for 2nm wafers.

Semiconductors are often described as the beating heart of cutting-edge technology. But while the United States may seek to ...

A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design ...

After setting fundamental and harmonic impedance to power-added-efficiency matching conditions, Ohki and co-workers ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

Samsung Electronics plans to adopt glass substrate interposers from conventional silicon interposers, according to a report ...

Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...

At this week's IEEE ECTC 2025 conference, research hub Imec demonstrated an integrated 300 mm RF silicon interposer platform ...

Chinese Apple competitor Xiaomi today announced the "Xring O1," a custom 3nm chip designed to rival Apple silicon (via ...