Intel is reportedly outsourcing more of its chips to TSMC on its new 3nm process node, with 3nm backend design outsourced and increased advanced packaging and testing by Taiwanese companies.

Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand ...

Apple is gearing up to use TSMC's latest SoIC advanced packaging technologies for its next-generation M5 chips as part of a two-pronged strategy for the company to power its future Macs and AI ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

Apple supplier ... The talks between Intel and TSMC were reportedly initiated by the Trump administration in an effort to stymy Intel’s decline and bring advanced chipmaking to the U.S. Intel ...

Taiwan's TSMC has ... The advanced packaging facility is set to be built in Peoria, Arizona. Notably, fan-out wafer packaging, a technology used by companies like Apple to connect memory to ...

Apple plans to use ... new paths in the field of advanced chip packaging in an innovative way – turning to rectangular chip substrates. According to a report, TSMC plans to switch from ...

Apple is set to be ... However, the collaboration between TSMC and Amkor will be more profound as the latter intends to offer TSMC’s CoWoS and InFo advanced packaging technologies for high ...

Taiwanese officials have made it clear that they’re unlikely to shift their most advanced nodes outside of Taiwan (below 2nm). As such, TSMC would likely only help Intel with their packaging of ...

Intel CEO Lip-Bu Tan confirmed ... These include Apple and Nvidia, which has started to make its advanced chips at the TSMC facility and has obtained its own manufacturing space here.