Intel is reportedly outsourcing more of its chips to TSMC on its new 3nm process node, with 3nm backend design outsourced and increased advanced packaging and testing by Taiwanese companies.

Over the last four years, the company has poured more than $90 billion into capital expenditures aimed at expanding its ...

Intel has reportedly placed 3nm orders with TSMC for its next-generation AI chip codenamed "Falcon Shores" which teases TSMC's new CoWoS advanced packaging will be used, with Falcon Shores ...

TSMC's advanced packaging tech and global expansion drive AI innovation and stock growth, despite geopolitical and capital ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most ...

Taiwan's TSMC has ... The advanced packaging facility is set to be built in Peoria, Arizona. Notably, fan-out wafer packaging, a technology used by companies like Apple to connect memory to ...

Apple is set to be ... However, the collaboration between TSMC and Amkor will be more profound as the latter intends to offer TSMC’s CoWoS and InFo advanced packaging technologies for high ...

Apple supplier ... The talks between Intel and TSMC were reportedly initiated by the Trump administration in an effort to stymy Intel’s decline and bring advanced chipmaking to the U.S. Intel ...

Apple plans to use ... new paths in the field of advanced chip packaging in an innovative way – turning to rectangular chip substrates. According to a report, TSMC plans to switch from ...

Taiwanese officials have made it clear that they’re unlikely to shift their most advanced nodes outside of Taiwan (below 2nm). As such, TSMC would likely only help Intel with their packaging of ...