Integrated circuits are compact electronic chips made up of interconnected ... A major new challenge posed by these multi-die packaging technologies is heat dissipation. When you consider that a ...

Thermal resistance from junction to case (θJC) is a metric of how easily heat flows from the die junction to the exposed pad (note that while FET devices have channels rather than junctions, the term ...

As with many inventions, two people had the idea for an integrated circuit at almost the same time. Transistors had become commonplace in everything from radios to phones to computers, and now ...

This acquisition will enable Teradyne to deliver scalable photonic integrated circuit (PIC) test solutions. PIC technology is leveraging wafer-based manufacturing, multi-die integration ...