Very low inductance packages are needed because the devices can switch in less than 20 ns. Thermal issues normally dictate the general form of the packaging of power transistors. A new system ...

Furthermore, thermal simulation about thermal resistance of MCM rtMLF was ... simulation tool was used for the electrical simulation tool to compare resistance, inductance and capacitance (RLC) ...

Another is that the increased lead and track lengths may create difficulties where a low-inductance design ... and design optimization through thermal simulation, this goal is one step closer.

We will be able to explore more design variants and to utilize electro-thermal simulation for new use cases that, until recently, were out of reach.” “Advanced packaging techniques such as 3D ...

In this article S parameter model, simulation of PCB parameters and measurements using VNA have been described. The measurements of PCB parasitic like inductance, capacitance, mutual inductance as ...

The results of the simulation and the experimental forming dimensions are basically in agreement.” said Lei Shi. Accurate modeling of the macro-scale thermal history provides critical input ...

He believes the fire-resistant textile industry’s innovation cycle—clothing manufacturers in particular—could be accelerated through the use of simulation technologies. Thermal simulation uses digital ...

“Our Thermal Simulation Rack allows customers and partners a more data-driven approach to confidently evaluate and adopt advanced liquid cooling solutions, like our NeuCool system, ensuring they ...